The
continuous development of electronics systems for communication able to
transfer high data rates has guided new designs to face an important issue for
their correct operation: thermal limitations. New designs of printed circuitboards (PCBs) have considered the use of high density processing speedsmicrochips, being accommodated in very compact boards with numerous other components
that, along with the main one, present high heat dissipation rates.
One might
consider that a few watts or even tenths of watts being dissipated by a given
component might not signify something to be considered upon performing a
thermal analysis. However, when taking into account the heat dissipation
density (heat dissipation rate per surface area), concerns related to system’s
thermal and mechanical designs began to be an important issue. To be able tosolve this thermal limitation, several solutions can be considered as many areavailable currently, from liquid cooling, high speed fans, etc. However, at
some point, the so-called ordinary solutions are not able to perform the
required heat dissipation and new solutions have to be applied.
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